Handling Boards and Assemblies
Caution - The chassis AC power cord must remain connected to ensure a proper ground.
Caution - The CPU/Memory+ boards, modules, and cards have surface-mount components that can be broken by flexing the boards.
To minimize the amount of board flexing, observe the following precautions:
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Hold the board only by the edges near the middle of the board, where the board stiffener is located. Do not hold the board only at the ends.
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When removing the board from an antistatic bag, keep the board vertical until you lay it on the Sun ESD mat.
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Do not place the board on a hard surface. Use a cushioned antistatic mat. The board connectors and components have very thin pins that bend easily.
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Do not use an oscilloscope probe on the components. The soldered pins are easily damaged or shorted by the probe point.
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Transport the board in an antistatic bag.
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Be careful of small parts located on the component side of the board.
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Be careful not to drag boards across surfaces as board components are easily damaged.
Caution - The heatsinks on the board can be damaged by incorrect handling. Do not touch the heatsinks while installing or removing the board. Hold the board only by the edges. If a heatsink is loose or broken, obtain a replacement board.
Caution - When inserting a board into slot 4 or slot 10 of a 16-slot card cage, lift the board slightly to avoid damage to the centerplane connectors.
Caution - The heatsinks on the board can be damaged by improper packaging. When storing or shipping the board, ensure that the heatsinks have sufficient protection.
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