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Sun Fire X4800 Server Service Manual
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Sun Fire X4800 Server Service Manual Overview

Server and Component Overview

Sun Fire X4800 Server Overview

Sun Fire X4800 Server Chassis Overview

Sun Fire X4800 Server CPU Module (CMOD) and Filler Module Overview

Sun Fire X4800 Server Subassembly Module Overview

Component Overviews

Power and Reset

Power Modes

Power Button and Power OK LED

How to Power On the Server

How to Power Off the Server

Controlling Server Power Remotely

Removing and Installing Components

Preparing for Service and Operation

Removal and Installation Procedures

Removing and Installing a Power Supply (CRU)

Removing and Installing a Hard Drive (CRU)

Removing and Installing a Hard Drive Filler

Replacing the Hard Drive Backplane (FRU)

Adding, Removing, and Installing a CMOD (CRU)

CPU Module (CMOD) Designation and Population Rules

Removing and Installing a CMOD Filler

How to Replace the CMOD Battery (CRU)

Removing and Installing DIMMs (CRU)

DIMM Population Rules

Removing and Installing a RAID Expansion Module (CRU)

How to Replace the RAID Expansion Module Battery (CRU)

Removing and Installing a Fabric Expansion Module (CRU)

Replacing a CPU and Heatsink Assembly (FRU)

Removing and Installing a Fan Module (CRU)

Replacing a Fan Module Controller Board (FRU)

Removing and Installing a NEM or a NEM Filler (CRU)

Removing and Installing a PCIe EM (CRU)

Removing and Installing the Service Processor Module (CRU)

Removing and Installing the Multi port Cable

Removing and Installing the Subassembly Module (FRU)

Sun Fire X4800 Server Service Procedures, and Information

Managing FRUID Information

Firmware Information and Procedures

How to Access the BIOS Setup Utility

Updating the CPLD

Component LED Locations and Meanings

Sun Fire X4800 Server Specifications

Physical Specifications

Power Specifications

Environmental Specifications

Index

Sun Fire X4800 Server Subassembly Module Overview

The Subassembly module (SAM) resides inside the chassis and contains the midplane on the internal front-facing side of the SAM and the back side server components on the back side of the SAM.

image:An illustration showing the front and back of the SAM.
Legend
1
SAM back side
2
SAM (internal) front–facing side showing midplane board

The SAM provides the interconnect between the AC power input lines and the power supply. It also provides the midplane interconnect between the back-end components (EMs, NEMs, and SP) and the front-side components (hard drives and CPU modules). Additionally, the SAM contains the cooling system for the CPU modules (CMODs). Cooling to the EMs, NEMs, and the SP module is provided by the power supply fans.


Note - The SAM is designated as a field-replaceable unit (FRU).


image:An illustration showing the back of the Subassembly module with call outs.
Item
Description
Overview
1
Four hot-swap-capable Fan modules (FMs) controlled by two Fan module controller boards (FBs) provide chassis cooling capability for up to 800W per CMOD (front-to-back air flow).
2
Two hot-swap-capable Network Express modules (NEMs) with four 10/100/1000Base-T Ethernet ports (per NEM), four 10 GigabitEthernet SFP+: SR, LR, LRM, Twin-ax (per NEM), and two (unsupported) 4x mini SAS connectors (6.0 Gb/s, 3.0 Gb/s, 1.5 Gb/s) (per NEM).
3
Eight hot-swap-capable Constellation PCIe Express modules with 8x PCIe 5 GT/s or 2.5 GT/s.
4
A hot-swap-capable SP module with two 10/100/1000Base-T Chassis management ports, a serial console port (RJ-45), and a UCP (universal connector port) for a multi port cable that provides KVMS access.
5
AC power block. Four AC power connectors with latching mechanisms.
Midplane interconnect board (not shown)

See also: