HBA Specifications

A P P E N D I X A

HBA Specifications

The chapter contains the specifications for the Sun StorageTek ExpressModule SAS HBA.

This appendix contains the following topics:

Physical Dimensions

PCI Performance

Physical Dimensions

The PCI Express module enclosure is 198mm x 120mm x 21.5mm and its weight is approximately 0.8 lbs. The PCI Express x8 connection is made through the edge connector J1. The design of the HBA follows the PCI Express ExpressModule Electromechanical Specification, Rev. 1.0.

PCI Performance

The PCI Express features of the HBA include the following:

Provides a scalable interface

Single-lane aggregate bandwidth of up to 0.5-GB/s (500MB/s)

Quad-lane aggregate bandwidth of up to 2GB/s (2000MB/s)

8-lane aggregate bandwidth of up to 4.0GB/s (4000MB/s)

Supports serial point-to-point interconnections between devices

Supports lane reversal and polarity inversion

Supports PCI Express Hot-Plug and PCI power management 1.2

Supports active state power management (ASPM), including the L0, L0s, and L1 states

Contains a replay buffer that preserves a copy of the data for retransmission in case of CRC error

Supports the PCI Express advanced error reporting capabilities

Uses a packetized and layered architecture

Achieves a high bandwidth per pin with low overhead and low latency

PCI Express is software compatible with PCI and PCI-X software

Leverages existing PCI device drivers

Supports the memory, I/O, and configuration address spaces

Supports memory read/write transactions, I/O read/write transactions, and configuration read/write transactions

Provides 4-KB of PCI configuration address space per device

Supports posted and nonposted transactions

Provides quality of service (QOS) link configuration and arbitration policies

Supports traffic class 0 and class 1 virtual channel

Supports message signaled interrupts (both MSI and MSI-X) as well as INTx interrupt signaling for legacy PCI support

Supports end-to-end CRC (ECRC) and advanced error reporting