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|Netra Blade X3-2B (formerly Sun Netra X6270 M3 Server Module) HTML Document Collection|
To remove a faulty processor (CPU) and heat sink assembly on the Netra Blade X3-2B motherboard, or for a processor upgrade.
Note - This component must be serviced by an Oracle-qualified service technician.
Caution - Handle processor socket pins with extreme care. Processor and socket pins are very fragile. A light touch can bend the processor socket pins and damage the board beyond repair.
Before You Begin
Preparing the Blade for Service , as required.
Identify a Faulty Processor, as required.
Clean heat sink if necessary. Remove any dust from the heat sink fins, as required.
Loosen the four Phillips captive screws in the heat sink for the faulty processor. Turn the screws counterclockwise alternately one and one half turns until they are fully removed.
Use a No. 2 Phillips screwdriver to alternately loosen each of the four spring-loaded mounting screws that secure the heat sink to the motherboard.
A thin layer of thermal compound separates the heat sink and the processor. This compound also acts as an adhesive.
Note - Do not allow the thermal compound to contaminate the work space or other components.
See Remove a Processor.