1. Virtual Signaling Transfer Point
  2. Overview of vSTP
  3. Time Division Multiplexing
  4. Feature Overview

2.10.1 Feature Overview

The TDM support functionality includes the following components

  • TDM Hardware: The hardware involves Adax HDC3 PCIe card with physical TDM connectivity supporting Virtual IO. This card contains built-in processor to process the MTP2 layer on hardware itself.

    Adax HDC3 PCIe card supports direct access using PCIe Pass-through. Therefore, a single Adax 4-port or 8-Port HDC3 PCIe card can be accessed only from a single VM at a time.

  • MTP Network Interworking Function (NIF): An additional MTP NIF layer is added to existing vSTP MP so that the MTP3 Layer can communicate with the MTP2 layer running on the TDM PCIe Card.

    The M3RL layer in vSTP MP VM communicates with the MTP2 layer running on the Adax HDC3 card via the MTP2 Adapter layer.

  • MTP2 Adapter: The MTP2 Adapter NIF layer on vSTP MP communicates with MTP2 layer using Virtual-IO calls. It uses the libraries and APIs provided by Adax to communicate with Adax HDC3 Card.

  • Host machine: The Host machine allows PCI Pass-through access to the vSTP MP virtual machines.