2.9.1 Feature Overview

The TDM support functionality includes the following components

  • TDM Hardware: The hardware involves PCIe card with physical TDM connectivity supporting Virtual IO. This card contains built-in processor to process the MTP2 layer on hardware itself.

  • MTP Network Interworking Function (NIF): §An additional (MTP Network Interworking Function - NIF) layer will be added to existing VSTP MP so that the MTP3 Layer can communicate with the MTP2 layer running on the TDM PCIe Card.

  • MTP2 Adapter: §The MTP2 Adapter (NIF) layer on VSTP MP shall communicate with MTP2 layer using Virtual-IO calls.

  • Host machine: §The Host machine shall allow PCI Pass-through Access to the vSTP MP virtual machines.