1. Exadata Server X10M Service Manual
  2. Servicing Processors

13 Servicing Processors

This section describes how to service processors.

Processors are replaceable components that require you to power off the server before servicing. For more information about replaceable components, see Illustrated Parts Breakdown and Replaceable Components.

Caution:

Ensure that all power is removed from the server before removing or installing a processor. You must disconnect the power cables from the system before performing these procedures.

Caution:

These procedures require that you handle components that are sensitive to electrostatic discharge. This sensitivity can cause the component to fail. To avoid damage, ensure that you follow electrostatic discharge safety measures and antistatic practices. See Electrostatic Discharge Safety.

Note:

On single-processor systems, processor socket 1 (P1) is shipped without a heatsink and with an External Cap. To protect the delicate processor socket pins, do not remove the External Cap that was installed on the motherboard.

Processor Overview

Socket components in the processor assembly have a pin 1 indicator to aid in assembly.

Figure showing SP5 processor components.
Callout Description

1

Pin 1 orientation

2

Force Frame Retention Screw (captive)

3

Rail Frame (socket stiffener frame)

4

Release Tabs (2x)

5

Force Frame (retention frame)

6

Processor Package (carrier frame holding preinstalled processor)

7

Heatsink Attachment Studs (6x)

External Cap

The external cap is used to protect the socket pins if the processor is not installed. The following figure shows the External Cap. Figure showing the External Cap.

Two processor sockets are located on the server motherboard.

Figure showing socket locations on the server motherboard assembly.

Identify and Remove a Processor

  • Use ESD gloves (not latex or vinyl), if possible, when handling the processor.

  • Obtain a torque driver set to 12 in-lb (inch-pound) (1.35 Nm/13.5 kg-cm) force with T20 Torx bit for processor and heatsink removal.

  • Be careful not to touch the processor socket pins.

    Caution:

    The processor socket pins are very fragile. A light touch can bend the processor socket pins beyond repair.

  • Remove thermal grease from the processor and any on the socket assembly before removing the carrier with the processor.

  • If thermal grease falls into the socket, there is no way to remove it without damaging the socket.

  • Do not allow the thin layer of thermal grease between the heatsink and the processor to contaminate the workspace or other components.

  • Failure to remove and replace thermal grease with new thermal grease can result in processor overheating.

  • Never remove the processor from the carrier. Replacement processors come with a carrier package. Figure showing the processor carrier frame.

  • Whenever you remove a processor on a usable motherboard, replace it with another processor and reinstall the processor heatsink; otherwise, the server might overheat due to improper airflow. See Install a Processor.

  1. Prepare the server for service.
    1. Power off the server.
    2. Disconnect the power cords from the power supplies.
    3. Extend the server to the maintenance position.
    4. Attach an antistatic wrist strap to your wrist, and then to a metal area on the chassis.
    5. Remove the server top cover.

      Use a Torx T15 screwdriver to unlock the release button latch.

      See Remove the Server Top Cover.

    6. Remove the air baffle.

      Remove the air baffle (sitting over the two processors) by lifting the baffle up and out of the server. Lift up the air baffle in the rear at a 50 degree angle, and slide slightly rearward to clear the air baffle tabs that prevent the front of the baffle from lifting up. Set aside the air baffle.

      See Remove the Air Baffle.

  2. Identify the location of the failed processor by pressing the Fault Remind button on the motherboard.

    Note:

    When you press the Fault Remind button, an LED located next to the Fault Remind button illuminates green, indicating that there is sufficient voltage in the fault remind circuit to illuminate any fault LEDs that were illuminated due to a failure. If this LED fails to illuminate when you press the Fault Remind button, it is likely that the capacitor powering the fault remind circuit lost its charge. This can happen if you press the Fault Remind button for a long time with fault LEDs illuminated, or if power was removed from the server for more than 15 minutes.

    The processor fault LED for the failed processor illuminates. The processor fault LEDs are located next to the processors. See Motherboard Status Indicators.

    • If the processor fault LED is off, the processor is operating properly.

    • If the processor fault LED is illuminated (amber), the processor failed and you must replace it.


    Figure showing how to identify a faulty processor by pressing the Fault Remind button.

    Callout Description

    1

    Fault Remind circuit power LED - green

    2

    Fault Remind button

    3

    Processor 0 fault LED - amber

    4

    Processor 1 fault LED - amber
  3. Using a Torx T20 screwdriver, loosen the six captive screws that secure the heatsink to the socket.
    Figure showing loosening processor-heatsink module six captive screws.

    Loosen in reverse order 6-1, then go back and disengage completely.

    1. Loosen captive screws 6,5,4,3,2,1 in the order shown in the illustration.

    2. Disengage captive screws 6,5,4,3,2,1 in the order shown in the illustration.

    Figure showing the processor heatsink screw loosening order.

    Use a torque driver set to 12 in-lb (inch-pound) (1.35 Nm/13.5 kg-cm) force with T20 Torx bit.

  4. Lift the heatsink from the socket.

    Caution:

    There is a thin layer of thermal grease between the heatsink and the processor. Do not allow the thermal grease to contaminate the workspace or other components.

    Note:

    Always grip the heatsink along the axis of the fins to prevent damage.

    Figure showing processor-heatsink module being removed from the socket.
  5. Place the heatsink, facing up, on a work surface.
  6. Remove Thermal Grease.

    Clean off the thermal interface material (TIM) using the supplied alcohol wipes.

    If reusing a processor, do not remove it from the processor carrier.

    Follow these steps if you plan on reusing either the heatsink or processor.

    1. Gather Thermal Grease Removal Materials required.
      1. 1. Techwipes or similar low-lint and low-abrasion wipe
      2. 2. Isopropyl alcohol (90% or above recommended)
      3. 3. Torx T20 screwdriver
      4. 4. SP5 socket protective lid

      Note:

      Some thermal greases may be classified as hazardous waste and should be disposed of in proper hazardous waste collection bins.
    2. Wipe the heatsink with a dry wipe to remove most of the thermal grease. Then add a small amount of isopropyl alcohol to a wipe and rub until there is no grease remaining.
      Figure showing wiping the heatsink with a dry wipe.

      Caution:

      Failure to clean thermal grease from the heatsink could result in the accidental contamination of the processor socket or other components. Be careful not to get the grease on your fingers, as this could result in contamination of components.
    3. Wipe the processor lid with a dry wipe to remove most of the thermal grease.
      Figure showing a dry wiped processor lid.
    4. Unscrew the socket Force Frame.
      Using a Torx T20 screwdriver, loosen the captive Force Frame Retention Screw that secures the Force Frame to the socket. Figure showing the force frame being loosened.
    5. Lift the Force Frame to the open position.

      Apply counter-pressure to the Force Frame when opening.

      Figure showing open position of the socket Force Frame.
    6. Open the Rail Frame.
      Squeeze the blue tabs to release the Rail Frame. Figure showing tabs of the socket Rail Frame.
    7. Lift the Rail Frame and slide out the carrier frame package.

      Lift the Rail Frame by holding its lift tabs and rotating the Rail Frame to its near vertical position.

      Figure showing the lifting of the Rail Frame to its vertical position.

      Note:

      The Rail Frame is spring-loaded. Hold on to the Rail Frame as it releases from the socket frame, when rotating it to the vertical position.

      Slide the carrier frame package holding the processor out.

      Figure showing the removal of the processor package.
    8. Place the carrier frame package in an appropriate tray.
      Figure showing tray with carrier frame.
    9. Wipe the Force Frame (retention frame) with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.

      Clean off the thermal interface material (TIM) as needed, wipe the outside and inside of the Force Frame with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.

      Figure showing wiping the Force Frame with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.
    10. Wipe the processor lid and carrier frame with a dry wipe followed by a wipe with a small amount of isopropyl alcohol.
      Clean off the thermal interface material (TIM) from the processor using the supplied alcohol wipes.

      Figure showing cleaning the Processor Lid in tray.

Install a Processor

  • Use ESD gloves (not latex or vinyl), if possible, when handling the processor.

  • Obtain a torque driver set to 12 in-lb (inch-pound) (1.35 Nm/13.5 kg-cm) force with T20 Torx bit for processor and heatsink installation.

  • Be careful not to touch the processor socket pins.

    Caution:

    The processor socket pins are very fragile. A light touch can bend the processor socket pins beyond repair.

  • If you are replacing a processor, ensure that the replacement processor is identical to the processor that was removed. For a list of supported processors, see Product Description.

  1. Attach an antistatic wrist strap to your wrist, and then to a metal area on the chassis.
  2. Open the new processor package.

    Ensure that the replacement processor is identical to the processor that was removed.

    The processor is preinstalled on the processor carrier.

    Figure showing the processor package.

    Note the orientation and correct handling of the processor package.

    Figure showing the use of the handle of the processor package.
    Callout Description

    1

    Top of processor carrier (insertion tabs are circled)

    2

    Bottom of processor carrier (contacts the socket)

    3

    Use of the processor carrier handle
  3. Install the processor package by sliding it in the Rail Frame and pressing down.
    Figure showing the processor being inserted into the Rail Frame.

    Holding the processor carrier by its handle, slide it into the Rail Frame, until the two insertion tabs at the bottom of the processor carrier are inserted into the slots in the Rail Frame.

    Figure showing two insertion tabs at the bottom of the processor carrier inserted into the slots in the Rail Frame.
  4. Grasping the Rail Frame edge [1], rotate the Rail Frame to the closed position [2].
    Figure showing how to close the processor Rail Frame.
  5. Rotate the Force Frame to its closed position on the socket stiffener frame.
    Figure showing the Force Frame being lowered onto the socket stiffener frame.
  6. Using a 12 in-lb (inch-pound) (1.35 Nm/13.5 kg-cm) driver with a Torx T20 bit, fully tighten the captive screw that secures the Force Frame to the socket stiffener frame.

    Use one hand to hold down the spring-loaded Force Frame until the screw is tightened.

    Figure showing the Force Frame being tightened.
  7. Apply Thermal Grease.
    Using the supplied syringe, evenly apply all of thermal interface material (TIM) in an "S" pattern centered on the top of the processor.

    Keep the "S" pattern inside a half inch of the processor edge so the grease doesn't overflow and contaminate other parts of the processor housing.

    Note:

    Do not distribute the TIM. The pressure of the heatsink will do so for you when you install the heatsink.
    Figure showing thermal interface material applied in an S pattern.
  8. Lower the heatsink (see the following note) on to the six socket heatsink attachment studs.
    Screws 1 and 2 are slightly longer than screws 3, 4, 5, and 6. Carefully lower the module.

    Note:

    The heatsink is keyed to go on only one way. The captive screws that attach to the pin 1 end of the socket stiffener frame are closer together than the captive screws that attach at the opposite end of the stiffener frame.
    Figure showing the heatsink being lowered.
  9. Tighten captive screws 1, 2, 3, 4, 5 and 6 in the order shown.
    Using a 12 in-lbf (1.35 Nm/13.5 kg-cm) torque driver with a Torx T20 bit, tighten the heatsink module to the socket, as shown in the following illustration. Figure showing the heatsink captive screws being tightened.

    1. Engage captive screws 1, 2, 3, 4, 5 and 6 in the order shown in the illustration.

    2. Tighten captive screws 1, 2, 3, 4, 5 and 6 in the order shown in the illustration from 12 in-lbf (13.5 kg-cm) to 13.02 in-lbf (15.0 kg-cm).

    Figure showing the processor heatsink screw tightening order.
  10. Return the server to operation.
    1. Install the air baffle.
    2. Install the server top cover.
    3. Return the server to the normal rack position.
    4. Reconnect the power cords to the power supplies, and power on the server.
    5. Verify that the power supply AC OK LED is lit.
  11. Use Oracle ILOM to clear server processor faults.
    1. To show server faults: log in to the server as root using the Oracle ILOM CLI, and type the following command to list all known faults on the server:

      -> show /SP/faultmgmt

      The server lists all known faults, for example:

      -> show /SP/faultmgmt
  Targets:
      shell
      0 (/SYS/MB/P0)
  Properties:
  Commands:
      cd
      show

      Alternatively, log in to the Oracle ILOM service processor from the Oracle ILOM Fault Management Shell and issue the fmadm faulty command. For more information about how to use the Oracle ILOM Fault Management Shell and supported commands, see the Oracle ILOM User's Guide for System Monitoring and Diagnostics at Oracle ILOM Documentation.

    2. To clear the fault identified in previous step, type the following command: set command

      -> set /SYS/MB/P0 clear_fault_action=true

      For example:

      -> set /SYS/MB/P0 clear_fault_action=true
Are you sure you want to clear /SYS/MB/P0 (y/n)? y
Set ‘clear_fault_action’ to ‘true’

      Alternatively, to clear all known faults in the server, log in to the Oracle ILOM service processor from the Oracle ILOM Fault Management Shell and issue the fmadm repair command.

      For more information about how to use the Oracle ILOM Fault Management Shell and supported commands, see the Oracle ILOM User's Guide for System Monitoring and Diagnostics at Oracle ILOM Documentation.