C H A P T E R  3

Netra CP2140 Board Specifications

This chapter provides the Netra CP2140 board specifications.

3.1 Board Features and Specifications

TABLE 3-1 shows the physical dimensions of the CPU board.

TABLE 3-1 Netra CP2140 Board Physical Dimensions

CPU Board Parameter

6U CompactPCI Form Factor


233.35 mm


160 mm


19.80 mm

Described below is some information on CompactPCI height restrictions and the Netra CP2140 board standard components.

The CompactPCI standard, PICMG 2.0 Rev 3, calls out the maximum component heights of 13.71 +/- 0.03 mm. Due to variations in parts, board flatness, board thickness, and manufacturing tolerances, the stacked height of two expansion memory boards and memory turrets installed on a CP2140 board may exceed this limit.

PICMG 2.0 R3 and IEEE 1101.10-1996 require 2.54mm between the top of components and the separation plane, and there is at least approximately 0.5mm to 2mm of clearance to solder-side components or leads of an adjacent board from that same separation plane. Therefore, there is very little chance that a small specification violation will impact an adjacent card in a PICMG 2.0 R3 compliant chassis.

Care should be taken when installing the boards in systems that have extreme solder-side component heights or in system chassis that don't allow clearances specified in the PICMG or IEEE standards.

TABLE 3-2 shows the system compatibility attributes.

TABLE 3-2 System Compatibility Attributes



System host capability


Satellite host capability


CompactPCI compliance

64-bit, 33 MHz, 5V bus interface; PICMG 2.0 R3.0 Bus specification

PICMG 2.1 R1.0 hot-swap specification

PICMG 2.9 D0.6 System Management specification

NEBS compliance

NEBS level 3 compliance


TABLE 3-3 shows a detailed description of the CompactPCI bus interface.

TABLE 3-3 CompactPCI Bus Interface





6U +5V, 33 MHz, 64 bits with support for seven additional external bus slots.


2mm pin-and-socket (IEC-1076-4-101)

3.1.1 CPU

TABLE 3-4 shows the CPU specification.

TABLE 3-4 CPU Specification




650 MHz UltraSPARC IIi


Sun 4U; 64-bit SPARC V9 architecture with the VIS Instruction Set


512 KB L2 cache

PCI bus local interface

PCI Bus 2.1 compatible, 33/66 MHz, 32-bit, 3.3V (internal to board only, does not come on connector)

3.1.2 Main Memory

TABLE 3-5 shows the memory specification.

TABLE 3-5 Memory Specification



Memory size--min

512 MB

Memory configuration--soldered

No soldered memory

Memory configuration--stackable

Up to two custom stackable modules; see TABLE 3-6 for allowable combinations

Memory type

3.3V, DRAM with ECC

LVTTL-compatible CMOS; configured on bus width of 64-bit + 8-ECC bits



TABLE 3-6 shows the Netra CP2140 board memory module configurations.

TABLE 3-6 Netra CP2140 Board Memory Module Configurations

Bottom SDRAM Module

PN and Specification

Top SDRAM Module

PN and Specification

Total Memory Available on Board











Note - The memory module configurations provided in TABLE 3-6 are the configurations that have been tested and are supported. Other memory configurations are possible on the Netra CP2140 board but customers will not receive technical support if they use other memory configurations.

Any two modules in any supported memory configuration can be installed in any combination (512 Mbyte, 1 Gbyte). However, if two memory modules need to be installed and one of the modules is double-sized, it should be installed on the bottom.

If a double-sized memory module is installed on the Netra CP2140 board, then the installation of a PMC card is not supported.

For detailed information on installation and removal of memory modules, see 256/512 MB Memory Module Installation and Removal Guide for Netra CP2000/CP2100 Series Compact Boards (816-0854-xx) and 1 GB Memory Module Installation and Removal Guide for Netra CP2000/CP2100 Series CompactPCI Boards (816-2917-xx).

3.1.3 PCI Mezzanine Module (PMC) Interface

TABLE 3-7 shows the PMC interface specification.


TABLE 3-7 PMC Interface Specification



PMC module interfaces on system board

One: PMC

Interface IEEE P1386.1 compliance

With draft 2.1

Connector configuration, PMC (P1386 designations)

J11, J12 carry PCI signals; J14 module
I/O is connected to CompactPCI backplane J3; J13 connector is not fitted

PMC connections to CompactPCI backplane

PMC I/O on J3

PCI clock

33 MHz

PCI bus width


CP2140 keyed for signalling voltage


Max power load--per module, combined 5V and 3.3V rails

7.5 W[2] Estimated Power Requirements

TABLE 3-8 shows the estimated power dissipation for Netra CP2140 board. Note that the figures provided in the table below are approximate and are application dependant.


TABLE 3-8 Estimated Power Dissipation for the Netra CP2140 Board

Configuration (Netra CP2140 Board with 650 MHz)

Watts Dissipation (Typical)

512 MB memory

Low power ~20 Watt typ. PCI mezzanine card and transition card not included (~32 Watt maximum)

Input power

+5V/3.3V/12V/-12V from CompactPCI backplane (with PCI mezzanine card support)

3.1.4 Mechanical

The Netra CP2140 board complies with the mechanical specifications found in the CompactPCI specification PICMG 2.0 R3.0.

3.1.5 Environmental Specifications

TABLE 3-9 shows the environmental conditions and limits.

TABLE 3-9 Environmental Conditions and Limits

Ambient Conditions

Lower Limits[3]

Upper Limits*

Transportation and storage temperature

-40° C for 72 hrs. max.

+70° C for 72 hrs. max.

Transportation and storage humidity

5% relative humidity, non-condensing

95% relative humidity, non-condensing

Operating temperature

0° C (-5° C short term)

40° C (55° C short term)

Operating humidity

5% relative humidity, non-condensing

85% RH (90% relative humidity short term) non-condensing

Shock and vibration

As stated in NEBS GR-63 CORE specifications, section 4.3.1 and 4.3.2 for shock criteria and 4.4.3 for vibration criteria;

MIL-STD 810E, Method 514.4, CAT I

MIL-STD 810E, Method 516.4, II-3.2

Electrostatic discharge

GR-1089 Section 2


0 foot to 10,000 feet operational (0 meter to 3408 meters)


300 linear feet per minute (LFM) (minimum requirement)


3.1.6 Reliability and Availability

Reliability prediction is the first measurement point of expected behavior of the inherent design mean time between failures (MTBF) of the product.

TABLE 3-10 shows the reliability prediction for board level MTBF.

TABLE 3-10 Reliability Prediction for Board Level MTBF


MTBF (hours)

Annualized Failure Rate (AFR in%)[4]

CP2140 board[5] + 2x512 MB memory



CP2140 board + 2x1 GB memory (double wide)



XCP 2140-TRN card



3.1.7 Compliance

All printed wiring boards (PWBs) are manufactured by UL recognized manufacturers, and have a flammability rating of 94-V1 or better. Compliance with EMI and safety regulations for products including the Netra CP2140 board is entirely the responsibility of OEMs. The Netra CP2140 board has passed FCC Class B tests in representative enclosures.

The Netra CP2140 boards are intended to be incorporated into systems meeting the following regulations and compliances:

  • USA FCC part 15 Class B
  • USA Safety UL 1950
  • Canadian ICES Class B
  • Canadian Safety CSA C22.2 Number 950
  • European Union EMC CE Mark EN55022 and EN50082-1
  • European Union Safety CE Mark EN 60950
  • European Union Safety TÜV
  • Japanese EMC VCCI Class B
  • NEBS Level 3
    Board requirements for NEBS Level 3 criteria provide the highest assurance of product operability with minimal service interruptions over the life of the equipment. The requirements include the following categories and all associated sections and subcategories:
    • NEBS GR-63-CORE, Issue 1, October 1995 - Network Equipment-Building System Requirements: Physical Protection
    • GR-1089-CORE, Issue 2, Revision 1, February 1999 - Electromagnetic Compatibility and Electrical Safety - Generic Criteria for Network Telecommunications Equipment

Note - Refer to the note in Section 2.13, Connecting Devices to a XCP2040-TRN I/O Transition Card.

3.1.8 Safety

Please read the cautionary note provided below.

caution icon

Caution - The Netra CP2140 board holds a lithium battery attached to the real-time clock, The battery is not a customer replaceable part. Do not dispose of battery in fire. Do not attempt to disassemble or recharge it. Failure to comply may cause the battery to explode.


1 (TableFootnote) The 1024MB (part no. 375-3026-xx) is a double wide memory module.
2 (TableFootnote) Sum of power allowable from any one rail or both rails together.
3 (TableFootnote) Short term, in this column, refers to a period of not more than 96 consecutive hours and a total of not more than 15 days in 1 year.
4 (TableFootnote) AFR (%) is Annualized Failure Rate based on 8,760 power on hours (POH) per year
5 (TableFootnote) Board ambient temperature at 40° C