Dual SuperSPARC modules consist of two processor sets on an MBus module. The modules attach to an MBus or SPARCŪ module connector on the SPARCserver(TM) 600MP system. Each module includes:
The MBus, described in an open specification from SPARC International, provides a standard chip interconnect between multiple CPUs, memory, and I/O.
The 600MP dual SuperSPARC modules are designed for operation in systems that are running the Solaris operating system revision 2.3 or later (or any other compatible operating system). There is a Solaris 2.3 Supplement that is required when using the revision 2.3 software.
OpenBoot(TM) PROM level 2.10 (or later) must also be installed in the system.
There are two dual SuperSPARC modules for the 600MP system board. The connectors and mounting rails are in different locations. The modules are slot specific and are not interchangeable. The locations of the module connector and the preinstalled mounting rails on the modules are specific to slot 0 or slot 1.
Figure 1-1 600MP Dual SuperSPARC Modules
Note - The shape of the waffle-like heatsink on your modules may vary from the illustrations in this manual.
This module has the connector on the right when you hold the dual SuperSPARC module with the component side facing you and the MBus connector pointing down toward the floor. See Figure 1-1.
This module has the connector on the left when you hold the dual SuperSPARC module with the component side facing you and the MBus connector pointing toward the floor. See Figure 1-1.
