The chapter contains the specifications for the Sun StorageTek ExpressModule SAS HBA.
This appendix contains the following topics:
Physical Dimensions
The PCI Express module enclosure is 198mm x 120mm x 21.5mm and its weight is approximately 0.8 lbs. The PCI Express x8 connection is made through the edge connector J1. The design of the HBA follows the PCI Express ExpressModule Electromechanical Specification, Rev. 1.0.
PCI Performance
The PCI Express features of the HBA include the following:
- Provides a scalable interface
- Single-lane aggregate bandwidth of up to 0.5-GB/s (500MB/s)
- Quad-lane aggregate bandwidth of up to 2GB/s (2000MB/s)
- 8-lane aggregate bandwidth of up to 4.0GB/s (4000MB/s)
- Supports serial point-to-point interconnections between devices
- Supports lane reversal and polarity inversion
- Supports PCI Express Hot-Plug and PCI power management 1.2
- Supports active state power management (ASPM), including the L0, L0s, and L1 states
- Contains a replay buffer that preserves a copy of the data for retransmission in case of CRC error
- Supports the PCI Express advanced error reporting capabilities
- Uses a packetized and layered architecture
- Achieves a high bandwidth per pin with low overhead and low latency
- PCI Express is software compatible with PCI and PCI-X software
- Leverages existing PCI device drivers
- Supports the memory, I/O, and configuration address spaces
- Supports memory read/write transactions, I/O read/write transactions, and configuration read/write transactions
- Provides 4-KB of PCI configuration address space per device
- Supports posted and nonposted transactions
- Provides quality of service (QOS) link configuration and arbitration policies
- Supports traffic class 0 and class 1 virtual channel
- Supports message signaled interrupts (both MSI and MSI-X) as well as INTx interrupt signaling for legacy PCI support
- Supports end-to-end CRC (ECRC) and advanced error reporting
Sun StorageTek ExpressModule SAS HBA Installation Guide
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820-3214-11
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Copyright © 2009 Sun Microsystems, Inc. All rights reserved.