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Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual
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Document Information

Using This Documentation

Sun Blade X3-2B Model Name Change

Getting the Latest Firmware and Software

Documentation and Feedback

About This Documentation

Support and Training

Contributors

Change History

Service Manual Overview

About the Sun Blade X3-2B

Product Description

Front Panel Features

Front Panel LEDs and Buttons

Rear Panel Features

About the System Chassis

About Oracle ILOM

About the Chassis Monitoring Module (CMM)

Replaceable Server Module Components

Preparing the Sun Blade X3-2B for Service

Obtaining the Server Module Serial Number

Powering Off the Server Module

Performing ESD and Antistatic Prevention Measures

Set Up for ESD Prevention

Managing the Locate LED

Remove the Server Module from the Sun Blade Chassis

Remove the Server Module Top Cover

Removing or Inserting Filler Panels

About the Multi-port Cable

Attach a Dongle Cable

Servicing Sun Blade X3-2B Components

Servicing a Storage Drive (CRU)

Servicing DIMMs (CRU)

Replace the System Battery (CRU)

Servicing USB Flash Drives (CRU)

Servicing a Fabric Expansion Module (CRU)

Servicing a RAID Expansion Module (CRU)

Servicing Cables (CRU)

Servicing a Processor and Heat Sink Assembly (FRU)

Servicing the Motherboard Assembly (FRU)

Returning Sun Blade X3-2B to Operation

Install the Server Module Top Cover

Install the Sun Blade X3-2B in the Chassis

Powering On the Server Module

Troubleshooting the Sun Blade X3-2B

Diagnosing Server Module Hardware Faults

Troubleshooting Using LED Status Indicators

Using the DIMM and Processor Test Circuit

Troubleshooting Server Module Power States

Troubleshoot Server Module Power Issues

Firmware and Software Troubleshooting

BIOS Power-On Self-Test (POST) Checkpoints

About POST Code Checkpoint Memory Testing

Viewing POST Code Checkpoints

POST Code Checkpoint Reference

Getting Server Firmware and Software

Firmware and Software Updates

Firmware and Software Access Options

Available Software Release Packages

Accessing Firmware and Software

Installing Updates

Index

Using the DIMM and Processor Test Circuit

If a DIMM or processor fails, the front panel Service Action Required LED lights. A lit Service Action Required LED indicates that immediate service action is required. You can use the internal DIMM or processor test circuit to identify the failed DIMM or processor component. Remove the server module from the server, open the top cover, and press the DIMM or processor test circuit Fault Remind button on the motherboard as soon as possible.

The test circuitry power charge has a time-limited window of usability (30–60 minutes). When the Fault Remind button is pressed, a Charge Status LED lights if the circuit is usable. If too much time has elapsed between removing the server module and viewing the test circuit LEDs, the charge can discharge completely. If the test circuit charge is completely depleted, the test circuit becomes unusable, the Charge Status LED turns off, and the Fault Remind error information is lost. To use the test circuit again, install the server module into the chassis, and let the error occur again.

For more information about how to identify faulty DIMMs or processors using on-board fault test circuits, see:

Error Correction and Parity

The server's processor provides data parity protection on its internal cache memories and error-correction code (ECC) protection. The system can detect the following types of errors: correctable and uncorrectable memory ECC errors and uncorrectable processor internal errors. Errors are recorded in the Oracle ILOM system event log (SEL).

Advanced ECC corrects up to 4 bits in error on nibble boundaries, as long as they are all in the same DRAM. If a DRAM fails, the DDR3 DIMM continues to function. For instructions for clearing DDR3 DIMM faults, refer to the Sun Blade X3-2B (formerly Sun Blade X6270 M3) Administration Guide.