Sun Blade X3-2B Model Name Change
Getting the Latest Firmware and Software
About the Chassis Monitoring Module (CMM)
Replaceable Server Module Components
Preparing the Sun Blade X3-2B for Service
Obtaining the Server Module Serial Number
Powering Off the Server Module
Performing ESD and Antistatic Prevention Measures
Remove the Server Module from the Sun Blade Chassis
Remove the Server Module Top Cover
Removing or Inserting Filler Panels
Servicing Sun Blade X3-2B Components
Servicing a Storage Drive (CRU)
Replace the System Battery (CRU)
Servicing USB Flash Drives (CRU)
Servicing a Fabric Expansion Module (CRU)
Servicing a RAID Expansion Module (CRU)
Servicing a Processor and Heat Sink Assembly (FRU)
Processor Fault Remind Circuit
Clear Server Module Processor Faults
Servicing the Motherboard Assembly (FRU)
Returning Sun Blade X3-2B to Operation
Install the Server Module Top Cover
Install the Sun Blade X3-2B in the Chassis
Troubleshooting the Sun Blade X3-2B
Diagnosing Server Module Hardware Faults
Troubleshooting Using LED Status Indicators
Using the DIMM and Processor Test Circuit
Troubleshooting Server Module Power States
Firmware and Software Troubleshooting
BIOS Power-On Self-Test (POST) Checkpoints
About POST Code Checkpoint Memory Testing
POST Code Checkpoint Reference
Getting Server Firmware and Software
Firmware and Software Access Options
Available Software Release Packages
See Preparing the Sun Blade X3-2B for Service .
Caution - Component damage. This procedure requires that you handle components that are sensitive to static discharge. This sensitivity can cause the component to fail. To avoid damage, ensure that you follow electrostatic discharge safety measures and antistatic practices. See Performing ESD and Antistatic Prevention Measures. |
A failed processor is identified by the amber processor Fault LED, as indicated in the following table.
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Next Steps