Motherboard – The motherboard includes slots for up to four CMP modules and four memory modules, memory control subsystem, up to eight PCIe expansion slots, and a service processor slot. The motherboard also contains a top cover safety interlock (“kill”) switch.
CMP module – Each CMP module contains an UltraSPARC T2 Plus chip, slots for four FB‐DIMMs, and associated DC-DC converters.
Memory module – A memory module containing slots for an additional 12 FB‐DIMMs is associated with each CMP module.
Service processor – The service processor (Oracle ILOM) board controls the server power and monitors server power and environmental events. The service processor draws power from the server’s 3.3V standby supply rail, which is available whenever the system is receiving main input power, even when the system is turned off.
A removable IDPROM contains MAC addresses, host ID, and ILOM and OpenBoot PROM configuration data. When replacing the service processor, the IDPROM can be transferred to a new board to retain system configuration data.
Power supply backplane – This board distributes main 12V power from the power supplies to the rest of the system. The power supply backplane is connected to the motherboard and the disk drive backplane via a flex cable. High voltage power is provided to the motherboard via a bus bar assembly.
Each drive has its own Power/Activity, Fault, and Ready-to-Remove LEDs.
Front control panel – This board connects directly to the motherboard, and serves as the interconnect for the front I/O board. It contains the front panel LEDs and the Power button.
Front I/O board – This board connects to the front control panel interconnect. It contains two USB ports.
Flex cable assembly – The flex cable assembly serves as the interconnect between the power supply backplane, motherboard, hard drive backplane, and DVD-ROM drive.
Power supply backplane I2C cable – This cable transmits power supply status to the motherboard.