| Netra CP2500 Board Installation and Technical Reference Manual
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Specifications for the Netra CP2500 board are provided in the following sections:
A.1 System Compatibility Specifications
The Netra CP2500 board is fully compatible with the Netra CT 410/810 servers. TABLE A-1 lists the attributes of a compatible cPSB chassis.
TABLE A-1 cPSB Chassis Compatibility Attributes
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Property
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Specification
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H110 chassis compatible
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CompactPCI J4 is unconnected at the board, which enables this board to be used in an H110 chassis
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NEBS
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NEBS Level 3 compliant chassis
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I/O Voltage
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Backplane power input (VIO) must be 5V.
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CompactPCI compatibility
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- PICMG 2.16 CompactPCI Packet Switched Backplane specification
- PICMG 2.1 R1.0 Hot-Swap specification
- PICMG 2.9 System Management specification
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Caution - The backplane power input (VIO) mustbe 5V. Otherwise, the board and the chassis can become seriously damaged.
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A.2 CPU Specifications
TABLE A-1 CPU Specifications
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Property
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Specification
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CPU
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UltraSPARC IIIi
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Architecture
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Sun 4U; 64-bit SPARC V9 architecture with the VIS instruction set
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Cache
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Integrated, 4 Mbyte, 4-way, set-associative internal L2 cache
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PCI bus local interface
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PCI Bus 2.1 compatible, 33 MHz, 32-bit, 3.3V (internal to board only)
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A.3 PMC Interface Specifications
TABLE A-2 PMC Interface Specification
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Property
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Specification
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PMC module interface on system board
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One PMC interface
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Interface IEEE P1386.1 compliance
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With draft 2.1
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Connector configuration, PMC A (P1386 designations)
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Jn1, Jn2 carry PCI signals; Jn4 module I/O is connected to the CompactPCI J5 backplane connector
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PCI clock
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33 MHz
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PCI bus width
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32-bit
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Max power load - per module, combined power rails (5V, 3.3V,
12V, -12V)
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7.5 W (5V keyed or universal)
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A.4 Power Requirements
This section provides information on power sequencing and power requirements by connection phase. TABLE A-3 shows the power drawn from the backplane connector by phase.
TABLE A-3 Netra CP2500 Backplane Connector Power Requirements by Connection Phase
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Power Rail
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No backplane power
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Main power on medium pins
(Typical configuration with two 1GB DIMMs installed)
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Description
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+5V
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0
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9 A
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At CompactPCI connectors J1/J2
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+3.3V
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0
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3 A
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At CompactPCI connectors J1/J2
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+12V
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0
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0.5 A
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At CompactPCI connectors J1/J2
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-12V
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0
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0
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At CompactPCI connectors J1/J2
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IPMB_PWR
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0.25
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0
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At CompactPCI connector J1/A4
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A.5 Mechanical Specifications
The Netra CP2500 board meets the mechanical specifications found in the CompactPCI specification PICMG 2.0 R3.0. FIGURE A-1 shows mechanical dimensions of the Netra CP2500 board panel, and FIGURE A-2 shows the mechanical dimensions of the board itself.
FIGURE A-1 Physical Dimensions of the Netra CP2500 Front Panel
FIGURE A-2 Mechanical Dimensions of the Netra CP2500 Board
A.6 Environmental Specifications
TABLE A-4 Environmental Conditions and Limits
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Ambient Conditions
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Low Limit
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High Limit
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Transportation and storage temperature
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-400 C
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+700 C
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Transportation and storage humidity
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5% RH
noncondensing
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95% RH
noncondensing
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Operating temperature
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00 C (-50 C short term)
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400 C (550 C short term)
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Operating humidity
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15% RH
noncondensing
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85% RH (90% RH short term)
noncondensing
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Shock and vibration
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NEBS GR-63 CORE - Sections 4.3.1 and 4.3.2 for shock criteria and Section 4.4.3 for vibration criteria
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Electrostatic discharge
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NEBS GR-1089 - Section 2
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A.7 Cooling Requirements
The CPU diode temperature should not exceed 1050 C when installed in the system. Refer to the Netra CP2500 Board Programming Guide (819-1749) for more information on thermal validation.
A.8 Reliability and Availability Specifications
Reliability, availability, and serviceability (RAS) specifications for the Netra CP2500 board are available through the Sun sales office under a nondisclosure agreement.