This chapter provides information needed to remove and replace SIMMs (on the system- or expansion memory board), fuses, boot PROMs, and NVRAMs.
Follow procedures in Chapter 1, "Preparation" and Chapter 2, "Printed Circuit Board Removal and Replacement" before attempting to remove components.
After replacing any component and installing the board into the card cage, monitor the power on process. Continue to Chapter 4, "Troubleshooting" to ensure that the system passes the Power-On Self-Tests and boots up.
SPARCsystem 600MP series systems may have 64 to 512 Mbyte of ECC Single In-line Memory Modules (SIMMs) installed on the system board. Depending on system type, you may have one or two optional expansion memory boards with a total of 512 Mbyte ECC SIMM memory. Total system memory may not exceed 1 Gbyte. Use this section in conjunction with Appendix A, "SIMM and Jumper Configuration" when removing and replacing SIMMs.
If you have purchased optional SIMMs and intend to install them yourself, read Appendix A, "SIMM and Jumper Configuration" before proceeding. Once you are familiar with the configuration rules, turn to the section in this chapter, "Installation" to complete the installation procedure.
Caution -
Use Sun ESD kit P/N 250-1088 (or equivalent) when installing integrated circuits, printed circuit boards, and drives in a SPARCsystem 600MP. Follow the instructions printed on the ESD mat. Refer to Section 1.4, "Electrostatic Discharge Precautions" for a description of the ESD mat.Before following these instructions, access the board intended for SIMM removal. Ensure you follow procedures in Chapters 1 and 2 for powering off the system, accessing the card cage, and removing the board.
To remove a SIMM on the system board or expansion memory board:
If the SIMM is on the system board, see Figure A-1, "SIMM and Jumper
Locations on the System Board."
If the SIMM is on the memory board, see Figure A-2, "SIMM and Jumper
Locations on the Expansion Memory Board." Refer to Appendix A, Section
A.2.3.1 to identify the failed board and u-number.
See Figure 3-1.
Figure 3-1 SIMM Extraction - Left Edge
Figure 3-2 SIMM Extraction - Right Edge
Locate the intended U-number and SIMM bank shown in Figure A-1, "SIMM and Jumper Locations on the System Board," or Figure A-2, "SIMM and Jumper Locations on the Expansion Memory Board."
Caution -
It is very important not to flex the board when you insert the SIMM, or press the board into a hard surface.Figure 3-3 Location of Pin 1 on a SIMM
This section describes how to remove and replace any fuses on the system board. The location of the fuses is shown in Figure A-1, "SIMM and Jumper Locations on the System Board." All fuses have the same Sun part number.
Caution -
Use Sun ESD kit P/N 250-1088 (or equivalent) when installing integrated circuits, printed circuit boards, and drives in a SPARCsystem 600MP. Follow the instructions printed on the ESD mat. Refer to Section 1.4, "Electrostatic Discharge Precautions" for a description of the ESD mat.To remove a fuse:
The plastic fuse socket is oriented horizontal to the system board.
The fuse may fit very snugly within the socket.
To replace a fuse:
Table 3-1 Fuses on the 600MP System Board
This section covers removal and replacement procedures for the Non-volatile Random Access Memory (NVRAM) and the boot PROMs, also called Erasable Programmable Read-Only Memory (EPROM).
Note - If the system board is replaced, you will need to remove the NVRAM from the original board and place it on the new board. The NVRAM contains unique information about a system, such as its serial number, ethernet address, and system type, and must remain with the system.
The location of the NVRAM is shown in Figure A-1, "SIMM and Jumper Locations on the System Board."
Caution -
Use Sun ESD kit P/N 250-1088 (or equivalent) when installing integrated circuits, printed circuit boards, and drives in a SPARCsystem 600MP. Follow the instructions printed on the ESD mat. Refer to Section 1.4, "Electrostatic Discharge Precautions" for a description of the ESD mat.If cards are installed in these slot positions, you will be unable to access the component. See Section 2.7, "Removing an SBus Card" to remove an SBus card.
Repeat this step on the opposite end to work the component free.
Pin 1 of the NVRAM is marked by a dot depression on the component surface. Pin 1 on the socket is below the notch, facing the system board connectors. Figure A-1 shows the NVRAM positioned on the system board.
See Section 2.8, "Installing or Replacing an SBus Card" to replace the card.
Use this procedure for Boot PROM upgrades. The location of the 4 boot PROMs are shown in Figure A-1, "SIMM and Jumper Locations on the System Board." See Table 1-1 for boot PROM part numbers.
Caution -
Use Sun ESD kit P/N 250-1088 (or equivalent) when installing integrated circuits, printed circuit boards, and drives in a SPARCsystem 600MP. Follow the instructions printed on the ESD mat. Refer to Section 1.4, "Electrostatic Discharge Precautions" for a description of the ESD mat.Refer to Section 2.7, "Removing an SBus Card" to remove an SBus card. The PROMs are now accessible.
Repeat Steps 2 and 3 on the opposite end to work the component free.
Each boot PROM has a different part- and U-number associated with it.
Boot PROM and pin 1 locations are shown in Figure A-1, "SIMM and Jumper Locations on the System Board."
See Section 2.8, "Installing or Replacing an SBus Card" to replace a card.