When certain parts and components in the server module, such as the motherboard, require replacing, you must replace a high-level assembly called the enclosure assembly. This assembly includes a new server module chassis, with the motherboard and many other components already installed.
If you determine that a faulty component is not one of the replaceable FRUs described in this service manual, replace the enclosure assembly of the faulty server module with a new enclosure assembly.
Note - This procedure must be performed by an Oracle field service representative.
When you use an enclosure assembly, you must move the following parts from the original server module to the same locations in the replacement enclosure assembly: Drives, drive fillers, DIMMs, REM, FEMs, SP, ID PROM, and USB flash drive.