Install a Processor Heat Sink

Clean the heat sink:
- Remove any dust or debris that might be lodged in the heat sink fins.
- Use an alcohol pad to completely clean all thermal compound from the underside of the heat sink.
Use the syringe (supplied with the new or replacement processor) to apply approximately 0.1 ml of thermal compound as a single dollop to the center of the top of the processor.
Note - Do not distribute or spread the compound; the pressure applied when attaching the heat sink performs this action.
Position the heat sink over the processor, aligning it with the threaded mounting posts.
Orient the heat sink so that the screws line up with the mounting posts. The processor heat sink is not symmetrical.

Caution - Component damage. When handling the heat sink, do not to transfer the compound to other server components.

Carefully lower the heat sink onto the processor taking care to reduce the amount of movement it makes after initial contact with the layer of thermal compound on top of the processor.

Caution - Over-temperature condition. Avoid moving the heat sink after it has contacted the top of the processor. Too much movement could spread the layer of thermal compound, causing voids in the distribution and leading to ineffective heat dissipation and component damage.

image:An illustration showing how to position and secure the heat sink.

Use a No. 2 Phillips screwdriver to alternately tighten each Phillips screw one-half turn until fully seated.
Prepare the server module for operation.
See Returning Sun Blade X3-2B to Operation .
Update the BIOS and ILOM firmware.
Refer to the Sun Blade X3-2B (formerly Sun Blade X6270 M3) Administration Guide and Setting Up Software and Firmware in Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide.

Next Steps

Clear Server Module Processor Faults

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	Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual