PCIe Gen3 half-height, half-width, single-slot x4 connector

Low-profile, half-height, and half-length PCIe 3.0 board

PCIe interface that complies with the PCI Express Specification 3.0

PCI low-profile MD2 specification

Add-in Card (AIC) Form Factor

Single slot x4 connector

Half-height, half-width, half-length, low-profile PCIe 3.0 board

Random Read/Write 4KB 70/30: Up to 160,000

Random Read/Write 8KB 70/30: Up to 75,000

Random 4K Read: Up to 440,000

Random 4K Write: Up to 70,000

Random 8K Read: Up to 260,000

Random 8K Write: Up to 42,000

Random Read/Write Consistency 4K/8K: 90%

High Endurance Intel^® 20nm eMLC NAND Flash Memory

Intel^® Flash Memory NVMe Controller ASIC

Uncorrectable Bit Error Rate (UBER): 1 sector per 10¹⁷ bits read

Mean Time Between Failure (MTBF): 2 million hours

T10 DIF protection

3.3V and 12V supply rail

Active/Idle (typical): Up to 25W/4W (typical)

Enhanced power-loss data protection

NVM Express 1.0c

PCI Express Base Specification Rev 3.0

Enterprise SSD Form Factor Version 1.0a

PCI Express Card Electro-Mechanical (CEM) Specification Rev 2.0

Up to 14 PBW (petabytes written)

5 Drive Writes/day (JESD219 workload)

Operating: -1,000 to 10,000 ft

Non-Operating: -1,000 to 40,000 ft

Operating:

• 0 to 55° C ambient, with specified airflow out of server through PCIe Card Slot

• Temperature monitoring (In-band and by way of SMBUS)

• Thermal throttling

Non-Operating: -55 to 95° C

Operating: 2.17 GRMS (5-700Hz)

Non-Operating: 3.13 GRMS (5-800Hz)