Install a Processor Heat Sink (FRU)

Document Information

Using This Documentation

Service Manual Overview

About the Sun Blade X4-2B

Troubleshooting the Server Module

Preparing for Service

Servicing Server Module Components

Servicing a Storage Drive (CRU)

Identifying Storage Drives

Identifying Storage Drive Indicators and Mechanical Components

Ready to Remove Indicator

Service Action Required Indicator

Power/OK Indicator

Lever and Lever Release Button

Storage Drive Failure and RAID

About Disk Backplane Cabling

Remove a Storage Drive

Install a New Storage Drive

Replace a Storage Drive

Remove Storage Drive Filler Panels

Insert Storage Drive Filler Panels

Servicing DIMMs (CRU)

DIMM Fault Remind Circuit and ECC Errors

Fault Remind Button and Charge Status Indicator

DIMM Fault Indicators

Inconsistencies Between DIMM Fault LEDs and the BIOS Isolation of Faulty DIMMs

Error Correction and Parity

Identify Faulty DIMMs

DIMM Population Rules and Guidelines

Basic Memory Guidelines

Detailed Memory Population Rules

Remove DIMMs

Install DIMMs

Servicing USB Flash Sticks (CRU)

Remove USB Flash Sticks

Install USB Flash Sticks

Servicing a Fabric Expansion Module (CRU)

Remove a FEM

Install a FEM

Servicing a RAID Expansion Module (CRU)

Remove a REM Card

Install a REM Card

Replace a REM Battery on the REM Card

Servicing Processors (FRU)

Selecting the Correct Processor Removal/Replacement Tool

Processor Fault Remind Circuit

Fault Remind Button and Charge Status Indicator

Processor Fault Indicators

Identify a Faulty Processor

Remove a Processor Heat Sink (FRU)

Remove a Processor (FRU)

Install a Processor (FRU)

Install a Processor Heat Sink (FRU)

Servicing the Motherboard Assembly (FRU)

Remove Motherboard Assembly Components (FRU)

Install Motherboard Assembly Components (FRU)

Update FRUID (Service Only)

Servicing the System Battery (CRU)

Returning the Server Module to Operation

BIOS Power-On Self-Test (POST) Checkpoints

BIOS Setup Utility Menu Options

Index

The replacement processor is not shipped with a heat sink. Reuse the original processor heat sink.

Before You Begin

Clean the heat sink:
- Remove any dust or debris that might be lodged in the heat sink fins.
- Use an alcohol pad to completely clean all thermal compound from the underside of the heat sink.
Use the syringe (supplied with the replacement processor) to apply the entire contents (approximately 0.1 ml) of thermal compound as a single dollop to the center of the top of the processor.
Note - Do not distribute or spread the compound; the pressure applied when attaching the heat sink performs this action.
Position the heat sink over the processor, aligning it with the threaded mounting posts.
Orient the heat sink so that the screws line up with the mounting posts. The processor heat sink is not symmetrical.
Caution - Component damage. When handling the heat sink, do not transfer the compound to other server components.

Carefully lower the heat sink onto the processor taking care to reduce the amount of movement it makes after initial contact with the layer of thermal compound on top of the processor.

Caution - Over-temperature condition. Avoid moving the heat sink after it has contacted the top of the processor. Too much movement could spread the layer of thermal compound, causing voids in the distribution and leading to ineffective heat dissipation and component damage.

image:An illustration showing how to position and secure the heat sink.

Use a No. 2 Phillips screwdriver to alternately tighten each Phillips screw one-half turn until fully seated.
Prepare the server module for operation.
See Return the Server Module to Operation.
Update the BIOS and ILOM firmware.
Refer to the http://www.oracle.com/goto/x86AdminDiag/docs and 5. Set up Server Module Software and Firmware (Oracle System Assistant) in Sun Blade X4-2B Installation Guide Setting Up Software and Firmware in Sun Blade X4-2B Installation Guide.

Next Steps

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	Sun Blade X4-2B Service Manual