1 About the Oracle Server X9-2

These sections describe the controls, connectors, status indicators, system components, and replaceable components of the server:

• Product Description

• Front and Back Panel Components

• About System Components

Note:

Always update the server with the latest firmware, drivers, and other hardware-related software by downloading the latest software release package when you first receive the server, and for every new software release. For information about the software release packages and how to download the software, refer to Getting Firmware and Software in Oracle Servers X9-2 and X9-2L Installation Guide at Oracle Server X9-2 Documentation.

Product Description

The Oracle Server X9-2 is an enterprise-class, one rack unit (1U) server. It supports the following components:

• Up to two Intel processors with the following capabilities are supported:

  • Intel Xeon Platinum, 32-core, 2.6 GHz, 250 W processors

  • Intel Xeon Gold, 24-core, 2.0 GHz, 165 W processors

  • Intel Xeon Gold, 18-core, 3.0 GHz, 205 W processors

  • Intel Xeon Silver, 16-core, 2.3 GHz, 135 W processors

• Up to sixteen DDR4 DIMMs per processor for a maximum of thirty-two 32-GB and 64-GB RDIMMs with speeds up to 3200 MT/sec are supported in dual-processor systems. Total supported memory is 2 TB.

• Up to three x16 PCIe Gen4 slots in dual-processor systems. PCIe slot 1 is nonfunctional in single-processor systems.

• Storage drive configurations can include the following:

  • Up to four 2-5-inch hot-pluggable NVM-Express (NVMe) solid-state disk drives (SSDs)

  • Two internal M.2 Gen3 SATA or PCIe Gen3 NVMe flash SSDs

• Two hot-pluggable, redundant 1200W (or 1400W) power supplies.

• Four hot-swappable fan modules, each containing two 40x56 mm counter-rotating fans.

• An on-board Oracle Integrated Lights Out Manager (Oracle ILOM) service processor (SP) based on the ASPEED Pilot 4 chip.

Front and Back Panel Components

The following sections describe the controls, indicators, connectors, and drives located on the front and back panels.

• Front Panel Controls and Indicators

• Back Panel Components and Cable Connections

About System Components

Illustrated Parts Breakdown

Front Panel Controls and Indicators

The following figure shows the controls, status indicators (LEDs), connectors, and drives on the front panel of the Oracle Server X9-2.

Callout	Description
1	Product Serial Number (PSN) label and Radio Frequency Identification (RFID) tag
2	Locate Button/LED: white
3	Fault-Service Required LED: amber
4	System OK LED: green
5	On/Standby button
6	Fault-Service Required LED: Top: Fan Module (amber)
7	Fault-Service Required LED: Rear: Power Supply (amber)
8	Fault-Service Required LED: Overtemp Icon: System Over Temperature Warning (amber)
9	SP OK LED: green
10	DO NOT SERVICE LED: white
11	Storage drive 0 NVMe
12	Storage drive 1 NVMe
13	Storage drive 2 NVMe
14	Storage drive 3 NVMe

Back Panel Components and Cable Connections

The following figure shows the Oracle Server X9-2 back panel and the location of power supplies, status indicators (LEDs), connectors, and PCIe slots.

Callout	Description
1	Power Supply (PS) 0
2	Power Supply (PS) 0 status indicators: Fault-Service Required LED: amber; AC OK LED: green
3	Power Supply (PS) 1
4	Power Supply (PS) 1 status indicators: Fault-Service Required LED: amber; AC OK LED: green
5	PCIe card slot 1 (Nonfunctional in single-processor systems)
6	System status indicators: Locate Button/LED: white; Fault-Service Required LED: amber; System OK LED: green
7	PCIe card slot 2
8	PCIe card slot 3
9	(Optional) 10/25/50/100/200 Gbs Open Compute Project (OCP) Version 3.0 (V3) Network Interface Card (NIC) with two QSFP ports (PORT 1 and PORT 2)
10	Oracle Integrated Lights Out Manager (ILOM) service processor (SP) network management (NET MGT) RJ-45 100/1000BASE-T port
11	Network (NET) 100/1000BASE-T RJ-45 Gigabit Ethernet (GbE) port: NET 0
12	Serial management (SER MGT) RJ-45 serial port
13	USB 3.0 connector

Note:

For more information on back panel components and connections, see Back Panel Connector Locations. See also Back Panel Pinhole Switch.

About System Components

These sections describe the components of the server:

• Illustrated Parts Breakdown

• Customer-Replaceable Units

• Field-Replaceable Units

Illustrated Parts Breakdown

The following figure identifies the major components of the server.

Callout	Description
1	Four storage drives
2	Front LED indicator module
3	Disk backplane
4	Fan modules
5	Top cover
6	Processors and heatsinks (Single-processor systems contain only a single processor in socket P0; socket P1 contains a cover to protect processor socket pins.)
7	Battery
8	Motherboard
9	Air baffles (P0, P1, and P1 exhaust)
10	Internal M.2 riser mezzanine and M.2 flash SSDs
11	(Optional) OCP V3 NIC
12	(Optional) PCIe card in slot 3
13	(Optional) PCIe card in slot 2
14	(Optional) PCIe card in slot 1 Note: PCIe slot 1 is nonfunctional in single-processor systems.
15	DIMMs (Sixteen DIMMs are supported in single-processor systems and the DIMMs must be installed in P0 DIMM sockets.)
16	Power supplies
17	PCIe risers (3)
18	Server chassis

Customer-Replaceable Units

The following table lists the customer-replaceable units (CRUs) in the server and directs you to the replacement instructions.

CRU (Service Level)	Description	Replacement Instructions
Battery (Cold service)	Lithium coin-cell battery that powers the CMOS BIOS and real-time clock.	Servicing the Battery (CRU)
DIMMs (Cold service)	Add or replace memory modules in the system.	Servicing the DIMMs (CRU)
Storage drives (Hot service)	Supports NVMe SSDs.	Servicing Storage Drives (CRU)
Internal M.2 flash SSDs (Cold service)	Supports up to two internal M.2 Gen3 SATA or PCIe Gen3 NVMe flash SSDs.	Servicing the Internal M.2 Flash SSDs (CRU)
Fan modules (Hot service)	Four fan modules for cooling the motherboard assembly and installed components.	Servicing Fan Modules (CRU)
PCIe cards (Cold service)	Optional add-on PCIe cards that can expand the functionality of the server.	Servicing PCIe Cards (CRU)
PCIe risers (Cold service)	Houses and connects the PCIe cards.	Servicing PCIe Risers (CRU)
Power supplies (Hot service)	Two fully redundant AC power supplies.	Servicing Power Supplies (CRU)

Field-Replaceable Units

The following table lists the field-replaceable units (FRUs) in the server and directs you to the replacement instructions.

FRU (Service Level)	Description	Replacement Instructions
Processor and heatsink (Cold service)	Processor that carries out the instructions of the system.	Servicing Processors (FRU)
Disk backplane (Cold service)	Serves as the interface between storage drives and the PCIe NVMe signals from the motherboard.	Servicing the Disk Backplane (FRU)
Front LED indicator module (Cold service)	Contains the push-button circuitry and LEDs that are displayed on the front panel.	Servicing the Front LED Indicator Module (FRU)
Temperature sensor (Cold service)	Provides temperature information for the system.	Servicing the Temperature Sensor (FRU)
OCP V3 NIC (Cold service)	(Optional) Provides two Gigabit Ethernet QSFP ports (PORT 1 and PORT 2) on the server rear panel.	Servicing the OCP Network Interface Card (FRU)
Motherboard assembly (Cold service)	Provides connectors for the fans, DIMMs, processors, PCIe risers, and power supplies.	Servicing the Motherboard Assembly (FRU)
NVMe cables (Cold service)	Provide signals between the disk backplane and the motherboard NVMe connectors.	Servicing the NVMe Cables