Chassis Overview

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The chassis consists of the front accessible components, internal components, and components accessible from the back of the server:

The following figure shows the front side components:

The front-side components include:

Call Out	Component	Link
1	Front indicator module (FIM)	Controls and Indicators
2	Four power supplies	Power Subsystem.
3 and 4	Eight fan modules (FMs) in two fan frames	Chassis Cooling Subsystem
5	Two internal CMOD bays	CPU Module (CMOD) Overview

The following figure shows the chassis internal components:

The chassis internal components include:

Call Out	Component	Description
1	CPU module (CMOD) bays	CMOD bays can support either four or eight CMODs. Servicing CMODs requires warm or cold service. For information about the CMODs, see CPU Module (CMOD) Overview.
2	Midplane/busbar	The mid-plane assembly provides an interconnect between the backside components and the front-side components. This component requires cold service.

The following figure shows the chassis backside components:

The chassis backside components include:

Call Out	Component	Description
1	System Module (SMOD)	The SMOD has internal components that can only be accessed by removing it from the backside of the server. For more information, see System Module (SMOD) Overview.
2	Dual PCIe card carrier (DPCC) bay	The DPCC bay contains eight DPCCs and up to 16 PCIe cards. For more information, see Storage and IO Subsystem.
3	AC power block	The AC power block has four AC power inlet connectors. The power block is not a removable component. For more information, see Power Subsystem.