Chassis Overview
The chassis consists of the front accessible components, internal components, and components accessible from the back of the server:
Chassis Front Components
At the front of the server, the chassis includes:
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Four power supplies
For more information about the power subsystem, see Power Subsystem.
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Front Indicator Module (FIM)
For more information about the server management subsystem, see System Management Subsystem.
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Eight fan modules (FMs) and two fan frames
For more information about the FMs and the chassis cooling subsystem, see Chassis Cooling Subsystem.
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Two CPU module (CMOD) bays
CMODs are accessible from the front of the server, after removing the FMs and the fan frames. For more information, see CPU Module (CMOD) Overview.
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Chassis Internal Components
Internal components include:
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Two CMOD bays that house four CMODs each. Removal and installation of the CMODs requires warm or cold service. For information about the CMODs, see CPU Module (CMOD) Overview.
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The mid-plane assembly, which provides an interconnect between the rear components and the front-side components. Removal and installation of the mid-plane assembly requires cold service.
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Chassis Rear Components
The rear of the chassis contains:
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System Module (SMOD)
The SMOD is removable and has internal components that are not directly accessible from the rear of the server. For more information, see System Module (SMOD).
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Dual PCIe card carrier (DPCC) bay
The DPCC bay contains eight DPCCs and up to 16 PCIe cards. For more information, see Storage and IO Subsystem.
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AC power block
The AC power block has four AC power inlet connectors. The power block is not a removable component. For more information, see Power Subsystem.
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