The chassis consists of the front accessible components, internal components, and components accessible from the back of the server:
At the front of the server, the chassis includes:
Four power supplies
For more information about the power subsystem, see Power Subsystem.
Front Indicator Module (FIM)
For more information about the server management subsystem, see System Management Subsystem.
Eight fan modules (FMs) and two fan frames
For more information about the FMs and the chassis cooling subsystem, see Chassis Cooling Subsystem.
Two CPU module (CMOD) bays
CMODs are accessible from the front of the server, after removing the FMs and the fan frames. For more information, see CPU Module (CMOD) Overview.
Internal components include:
Two CMOD bays that house four CMODs each. Removal and installation of the CMODs requires warm or cold service. For information about the CMODs, see CPU Module (CMOD) Overview.
The mid-plane assembly, which provides an interconnect between the rear components and the front-side components. Removal and installation of the mid-plane assembly requires cold service.
The rear of the chassis contains:
System Module (SMOD)
The SMOD is removable and has internal components that are not directly accessible from the rear of the server. For more information, see System Module (SMOD).
Dual PCIe card carrier (DPCC) bay
The DPCC bay contains eight DPCCs and up to 16 PCIe cards. For more information, see Storage and IO Subsystem.
AC power block
The AC power block has four AC power inlet connectors. The power block is not a removable component. For more information, see Power Subsystem.