Go to main content

Oracle® Server X5-2 Service Manual

Exit Print View

Updated: January 2018
 
 

Illustrated Parts Breakdown

The following figure identifies the major components of the server.

Figure 1  Server Illustrated Parts Breakdown

image:Figure showing exploded view of the system components.

Callout
Description
1
Storage drives
2
Front indicator module (FIM)
3
Disk backplane
4
Super capacitor (Energy storage module for the Oracle Storage 12 Gb/s SAS PCIe RAID HBA in PCIe slot 4.)
5
Fan modules
6
Motherboard
7
Processors

Note -  In single-processor systems, neither a heatsink nor a processor socket filler are installed in the processor socket 1 (P1). To protect the delicate processor socket pins, the cover that comes on the motherboard from manufacturing is left in place.

8
Heatsinks
9
Battery
10
USB flash drives (One of the USB flash drives is used for Oracle System Assistant.)
11
Air baffle
12
Top cover
13
(Optional) PCIe card in slot 3
14
Oracle Storage 12 Gb/s SAS PCIe RAID HBA card in PCIe slot 4
15
(Optional) PCIe card in slot 2
16
(Optional) Oracle PCIe NVMe switch card or standard PCIe card in slot 1

Note -  PCIe slot 1 is nonfunctional in single-processor systems.

17
PCIe risers (3)
18
DIMMs

Note -  A maximum of 12 DIMMs are supported in single-processor systems and the DIMMs must be installed in sockets associated with processor 0 (P0). No DIMM filler panels are required in vacant DIMM sockets associated with processors 0 (P0) or 1 (P1).

19
Power supplies
20
Server chassis
21
(Optional) DVD drive