Transfer Components to the New Enclosure Assembly

Language:

When you replace an enclosure assembly, you must move a number of FRUs from the original server module to the same locations in the replacement assembly. See Component Locations.

When you transfer the SP and ID PROM from the old board to the new you preserve system-specific information that is stored on these modules.

When you replace the motherboard, the firmware on the new motherboard might be incompatible with the firmware on the SP. In this case, you must update the system firmware, which updates the SP and motherboard firmware to compatible versions.

Prepare to take all ESD precautions when working with both the original server module and the new enclosure assembly.
Prepare to place all components on an antistatic mat unless you install each component immediately in the new enclosure assembly.

Follow the precautions explained in Preparing for Service.

Remove the top cover from the original server module and the new enclosure assembly.
See Remove the Cover.

Transfer the drives and driver fillers from the original server module to the enclosure assembly.
See Servicing Drives.

Transfer the FEM (if present) from the original server module to the enclosure assembly.
Install the FEM in the same connectors in the enclosure assembly. See Servicing the FEM.

Transfer the SP card from the original server module to the enclosure assembly.
See Servicing the SP Card.

Transfer the ID PROM from the original server module to the enclosure assembly.
See Servicing the ID PROM.

Transfer the USB drive (if present) from the original server module to the enclosure assembly.
Ensure that you install a USB drive only in the top slot of the connector. See Servicing the USB Drive.

(If needed) Transfer the battery to the enclosure assembly.
If a battery is present in the new enclosure assembly, do not transfer the original battery.

See Servicing the Battery.

Transfer the DIMMs from the original server module to the enclosure assembly.
Move each DIMM to the same slot in the enclosure assembly. See Servicing DIMMs.

Attach the original cover to the enclosure assembly.
See Returning the Server Module to Operation.

Insert the completed enclosure assembly in the same slot as the original server module.
See Returning the Server Module to Operation.

Start the server module host.
See Powering On the Host.

Access Oracle ILOM on the SP.
See Log Into Oracle ILOM (Service).

If the replacement SP detects that the SP firmware is not compatible with the existing host firmware, further action is suspended and this message is displayed:
```
Unrecognized Chassis: This module is installed in an unknown or
unsupported chassis. You must upgrade the firmware to a newer
version that supports this chassis.
```
If you see this message, go to Step 14. Otherwise, go to Step 15.

Download the system firmware.
Refer to Servers Administration, Updating Firmware and to Oracle ILOM documentation for instructions.

Perform diagnostics to verify the proper operation of the server module.
See Detecting and Managing Faults.

Transfer the serial number and product number to the FRUID of the new enclosure assembly.
This must be done in a special service mode by trained service personnel.

Note - The replacement enclosure assembly does not have a label with the serial number on the front of the server module, as was present on the original server module.

(Optional) Update any customer database that contains RFID data.
Use the values from the RFID on the new enclosure assembly.

The RFID on the original server module contains different values.

Consider your next step:
- Power on the host – See Powering On the Host.
- Run POST or Oracle VTS to verify the server module --- See Understanding Diagnostics and Tools.

SPARC T5-1B Server Module Service Manual

Transfer Components to the New Enclosure Assembly

Related Information